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- CIES Consortium
- Industry-Academic Collaboration
- STT-MRAM and its Manufacturing Process Technologies
- Automatic design for Non-volatile LSI
- Supersensitive Magnetic Sensors
- 3D Wireless SESUB
- 2D/3D Integrated Image Processing
- Embedded Security System
- Real-World Intelligent System
- National Projects
- JST ACCEL
Low Power DRAM・STT-MRAM with Vertical BC-MOSFET - CSTI ImPACT
Spintronics integrated circuit project - JSPS Core-to-Core
Controlled Interfacing of 2D materials for Integrated Device Technology - NEDO
GaN bidirectional power converter - NEDO
Development of evaluation equipment for magnetic and electrical properties of MRAM development and its shipping inspection - Community-based cooperation Projects
Tohoku University,
Center for Innovative Integrated Electronic Systems
468-1 Aramaki Aza Aoba,
Aoba-ku, Sendai, Miyagi
980-0845, JAPAN
TEL +81-22-796-3410
FAX +81-22-796-3432
[email protected]
Access
Center for Innovative Integrated Electronic Systems
468-1 Aramaki Aza Aoba,
Aoba-ku, Sendai, Miyagi
980-0845, JAPAN
TEL +81-22-796-3410
FAX +81-22-796-3432
[email protected]
Access
